Solution
Tailored solutions to address industry challenges
Customized server chassis solutions within the Artificial Intelligence (AI) industry center on the core objectives of "accommodating AI computing demands, unlocking hardware potential, and reducing operational costs." Tailored to address three pivotal scenarios—AI training, AI inference, and Edge AI—these solutions deliver specialized server chassis designs. Their core value is manifested across five key dimensions, precisely addressing the industry's critical pain points:
The artificial intelligence (AI) industry is experiencing explosive growth in computing demand. From large-scale AI model training and deep learning inference to edge AI deployment, modern AI infrastructure requires server hardware with:
High-density computing capability
Extreme power support
Advanced thermal management
High reliability
Flexible scalability
Traditional standard server chassis can no longer satisfy the requirements of multi-GPU parallel computing, ultra-high-power AI accelerators, low-latency interconnect architecture, and large-scale AI cluster deployment.
Our AI server chassis customization solution is built around deep engineering customization capability, providing full-stack solutions ranging from single AI server chassis to large-scale rack-level AI supernodes. The solution effectively solves the core challenges between computing density, cooling efficiency, operational reliability, and maintenance complexity, helping AI enterprises improve deployment efficiency and reduce operating costs.
The AI server chassis solution is designed around three core objectives:
Adapting to AI computing requirements
Maximizing hardware performance
Reducing operational costs
The solution is optimized for three major AI scenarios:
AI model training
AI inference deployment
Edge AI computing
Break through the limitations of standard chassis designs with support for:
1U 4-GPU configurations
4U 10–12 GPU configurations
Ultra-dense multi-node AI clusters
The solution improves computing density per rack by 4–20 times, significantly reducing data center space requirements and infrastructure costs.
AI accelerators such as GPUs, TPUs, and XPUs often exceed 400W TDP per card.
Our customized hybrid cooling system combines:
Liquid cooling
Air cooling
Direct liquid cooling (DLC)
Immersion cooling support
The solution maintains critical component temperatures below 65°C while reducing PUE values to 1.1–1.4, lowering annual electricity costs by 30–50%.
Compatible with mainstream AI platforms including:
NVIDIA H100 / H200
AMD MI300
Kunlunxin P800
Cambricon AI accelerators
Supports:
PCIe 5.0
OCP 3.0
Multi-generation hardware upgrades
MTBF exceeds 100,000 hours, ensuring stable 24/7 high-load operation.
The modular hot-swappable architecture reduces troubleshooting and replacement time by over 80%.
Supports:
Hot-swappable GPUs
Redundant power supplies
Hot-swappable fans
Integrated chassis-level BMC monitoring
Remote fault alarms and management
Single-node maintenance can be completed by one engineer.
The solution supports:
Large-scale AI training clusters
Cloud AI inference systems
Edge AI computing
Vehicle AI
Industrial AI
Medical AI
From high-density AI data centers to harsh outdoor edge environments, customized solutions are available for every deployment scenario.
Multi-GPU configurations create airflow congestion
Extremely high rack power density (30–120kW)
Thermal throttling risks
High interconnect latency
Heavy server weight and maintenance complexity
Frequent hardware upgrades
2U / 3U / 4U rackmount architecture
800–1200mm chassis depth for full-length GPUs
Reinforced steel frame structure
Weight support exceeding 150kg
High-density GPU cluster architecture
Supports up to:
64 GPUs per rack node
640 GPUs per AI cluster deployment
Hybrid liquid + air cooling architecture:
Direct liquid cooling (DLC)
Immersion cooling compatibility
Independent CPU/GPU airflow channels
Intelligent fan matrix with N+1 redundancy
Dynamic thermal control system
Cooling efficiency improves by over 60% compared to traditional air cooling.
Supports:
Dual/quad Intel Xeon CPUs
AMD EPYC processors
EEB / ATX / custom motherboards
8–12 PCIe 5.0 slots
High-end NVIDIA HGX platforms
3300W / 5500W redundant power modules
Redundant power configurations include:
AC + AC
AC + DC
DC + DC
Optimized NVLink / NVSwitch cable routing
Non-blocking interconnect architecture
Modular CPU/GPU/PCIe switch separation
Front status indicators
Integrated BMC monitoring
Remote monitoring and alert systems
Cloud inference environments require balancing density and power consumption, while edge AI inference requires:
Compact deployment
Wide-temperature operation
Dustproof design
Low maintenance cost
Flexible expansion capability
Some applications also require:
Low noise
Compact size
Lightweight deployment
1U / 2U short-depth rackmount chassis
Embedded and wall-mounted edge AI chassis
Aerospace-grade aluminum alloy construction
40% weight reduction
Compact installation optimization
Supports:
-40°C to 70°C wide-temperature operation
IP54 / IP65 protection
Corrosion-resistant coating
50G shock resistance
Suitable for:
Vehicle AI
Outdoor AI stations
Industrial edge AI environments
Supports:
1–4 inference GPUs
NVIDIA T4 / A10
AMD Radeon Pro
PCIe 4.0 / 5.0
OCP 3.0 standard
Compatible with:
Mini-ITX
ATX motherboards
Low-power CPU platforms
Blind-mate modular node design
Rapid deployment capability
Remote IPMI / Redfish management
Centralized node monitoring
Optimized cable management structure
Features:
Shock-resistant reinforced structure
DC power input support
Low-power cooling optimization
Vibration-resistant design
Features:
IP65 sealed enclosure
EMC electromagnetic shielding
Wide-temperature operation
Dustproof and corrosion-resistant structure
Features:
Ultra-low-noise design (≤45dB)
Medical safety compliance
Rounded edge structure
Secure physical locking system
Medical interface customization
Material options include:
SECC galvanized steel
Aerospace-grade aluminum alloy
CFRP composite materials
Manufacturing standards:
Precision sheet metal fabrication
CNC machining
±0.5mm tolerance accuracy
Fully welded reinforced structure
Modular architecture design
Front-to-back airflow design
Independent GPU / CPU airflow channels
Hot aisle / cold aisle compatibility
Intelligent airflow isolation system
Supports:
Air cooling
Liquid cooling
Hybrid cooling
Immersion cooling
Liquid cooling can reduce core temperatures by over 20°C.
High static pressure fans
MTBF ≥100,000 hours
N+1 redundancy support
Low-noise fan options available
Supports mainstream AI hardware including:
NVIDIA
AMD
Kunlunxin
Cambricon
Compatible with:
PCIe 4.0 / 5.0
OCP 3.0
ATX / EEB / ITX / custom motherboards
Expansion capability:
Up to 48 hot-swappable drives
Flexible 1–12 GPU configurations
Multi-generation upgrade support
Supports:
Lightning protection
Anti-static protection
Over-current protection
Anti-tamper design
Optional encrypted storage interface
Certifications include:
CE
FCC
CCC
EMC compliance
ISO9001 quality management
7×24 technical consultation
Preliminary solution within 24 hours
Dedicated engineering support team
Every chassis undergoes:
High-temperature testing
Vibration testing
EMC testing
Long-term reliability testing
MTBF exceeds 100,000 hours.
Supports:
Single-unit prototyping
Large-scale mass production
Full customization from structure to interfaces and cooling systems
1–3 year warranty
Lifetime technical support
Spare parts inventory
24-hour fault response system
We invest 8% of annual revenue into R&D and collaborate with universities and AI hardware manufacturers to continuously improve:
Cooling systems
Density optimization
Hardware compatibility
AI infrastructure scalability
Our solutions evolve together with the rapid advancement of AI computing technologies.
